2026 IEEE International Conference on Embedded Software and Systems

Luoyang, Henan, China

October 29 - November 02, 2026

Important Dates


Paper Submission
July 15, 2026

Authors Notification
September 10, 2026

Camera-Ready Submission
September 30, 2026

Registration Due
September 30, 2026

Conference Dates
October 29- November 02, 2026

Organizing Committee


General Chairs
Kim Fung Tsang, City University of Hong Kong, China
Jocl J. P. C. Rodrigues, Federal University of Piaui (UFPI), Brazil
Marcin Paprzycki, Polish Academy of Sciences, Poland

Program Chairs
Zhigao Zheng, Wuhan University, China
Yun Lin, Harbin Engineering University, China
Allahyar Montazeri, Lancaster University, UK

Program Vice-Chairs
Yuezu Lv, Beijing Institute of Technology, China
Wei Wang, Sun Yat-sen University, China
Xin Nie, Zhengzhou University, China

Publicity Chairs
Jiahui Chen, University of Electronic Science and Technology of China, China
Yixiu Liu, Hangzhou Dianzi University, China

Web Chair
Jiawei Wang, University of Warwick, UK

Steering Chairs
Laurence T. Yang, St. Francis Xavier University, Canada
Dakai Zhu, The University of Texas at San Antonio, USA
Yier Jin, University of Florida, USA

Join us at the 2026 IEEE International Conference on Embedded Software and Systems

IEEE ICESS-2026, the International Conference on Embedded Software and Systems, serves as a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems across diverse application domains.

With the rapid development of high-performance embedded chips, the computing capabilities of edge devices have been significantly enhanced, enabling them to handle computation-intensive tasks in real time. As a result, an increasing number of artificial intelligence (AI) applications are being deployed on edge computing platforms to ensure low-latency responses and efficient processing. The integration of edge computing and AI has led to the emergence of edge intelligence, an innovative paradigm that combines networking, computing, storage, and application capabilities. By deploying intelligent algorithms closer to end users, edge intelligence enables more efficient and responsive intelligent services. Compared with cloud-based AI models, edge intelligence offers advantages such as lower power consumption, reduced latency, enhanced security, and improved user proximity. Consequently, edge intelligence has become a prominent research topic in recent years. In parallel, leading global enterprises such as Huawei, Google, Microsoft, Amazon, and Cisco are actively investing in this area to accelerate advancements in precision agriculture, smart healthcare, smart cities, industrial Internet of Things, and related industries.

IEEE ICESS-2026 will be held in Luoyang, China, a historic city known for its rich cultural heritage and as one of the ancient capitals of China. The city is home to world-renowned landmarks such as the Longmen Grottoes and the White Horse Temple, offering an inspiring environment that blends tradition with modern innovation.

The focus of ICESS-2026 is to present novel research contributions that advance the state of the art and deepen the understanding of challenges in embedded software and systems, particularly in areas related to edge intelligence, including AI model deployment, task scheduling, resource management, system design and optimization, collaborative methodologies, and integrated software and system solutions.

Prospective authors are invited to submit their papers to ICESS-2026. Accepted papers will be submitted for inclusion into IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements. Authors of selected best papers will be invited to extend their contributions for special issues of prestigious journals planned in conjunction with the conference.

Topics of interest include, but are not limited to:

  • Track 1: Edge Intelligence
    • Embedded systems and software for edge intelligence
    • Real-time systems and software for edge intelligence
    • Multimodal sensing fusion systems and software for edge intelligence
    • AI chip design for edge intelligence
    • Lightweight AI model design for edge intelligence
    • Task scheduling and resource management for edge intelligence
    • Low-power and high-reliability designs for edge intelligence
    • Embedded AI model training methods
    • AI framework design and optimization for edge devices
    • Intelligent sensing, interaction, and decision system design
    • Edge–edge, edge–cloud, and end–edge–cloud collaborative methodologies
    • Model, operator, and hardware optimization for robotics, UAVs, and autonomous driving
    • Other edge intelligence systems and applications
  • Track 2: Systems, Models and Algorithms
    • Embedded system architectures
    • Embedded software architectures
    • Embedded operating systems, scheduling, and runtime support
    • Embedded storage and I/O systems
    • Real-time embedded systems
    • Distributed and networked embedded systems
    • Fault-tolerant and trusted embedded systems
    • Power- and thermal-aware computing
    • Mixed-criticality embedded systems
    • Heterogeneous SoC and multicore embedded systems
    • Reconfigurable embedded computing
  • Track 3: Design Methodology and Tools
    • Design technologies of embedded systems
    • Formal methods for embedded systems
    • Middleware for embedded systems
    • Integrated development environments and software tools
    • Hardware/software co-design
    • Component-based embedded software design
    • Model-based design for embedded software
    • Domain- and application-specific design techniques
    • Testing techniques for embedded software and systems
    • Verification and validation for embedded systems
    • Compilation and debugging techniques and tools
    • Performance evaluation techniques and tools
    • Safety of machine learning for embedded systems
  • Track 4: Emerging Embedded Applications and Interdisciplinary Topics
    • Intelligent embedded systems
    • Machine learning for embedded applications
    • Internet of Things (IoT)
    • Wearable computing
    • Smart city applications
    • Intelligent traffic signal control systems
    • Robotics and control systems
    • Wireless sensor networks
    • Cyber-physical systems (CPS)
    • Assured autonomy for safety-critical CPS
    • Automotive and avionics systems
    • Medical systems
    • Database and multimedia systems
    • Network protocols and security
    • Emergency and disaster management
    • Consumer electronics, mobile cloud computing, and approximate computing
    • Industrial practices and case studies

Paper Submission

All papers need to be submitted electronically through the conference submission website (EDAS) in PDF format at https://edas.info/N35264. Each paper is limited to 8 pages (or 10 pages with over-length charge) for a regular full paper, 6 pages (or 8 pages with over-length charge) for a full paper including figures and references using the IEEE Computer Society Proceedings manuscript style.

Paper Publication

Papers accepted by IEEE ICESS 2026 conference will be published by the IEEE Computer Society Press. At least one author of each accepted paper is required to register and present their work at the conference; otherwise, the paper will not be included in the proceedings. All accepted papers will be submitted to IEEE Xplore and EI. Distinguished papers presented at the conference, after further revision, will be invited for submission to a special issue:

  • IEEE Transactions on Consumer Electronics – Generative AI for Consumer Electronics
  • IEEE Transactions on Computational Social Systems – Cyber-Physicial Intelligence: State-of-the-art, Perspectives, and Challenges
  • IEEE Internet of Things Journal – Large Model-Driven Intelligent Computing Optimization in the Artificial Intelligence of Things (AIoT)
  • IEEE Internet of Things Journal – Integrated Sensing, Memory, Communication and Computation for Large-Scale AI Based IoT Systems
  • Journal of Systems Architecture – Sustainable Computing Algorithm, Architecture, and Applications for LLM in Embedded Computing Systems
  • Journal of Systems Architecture – Security and Efficiency for LLM-Based Edge Intelligence
  • Applied Sciences – Collaboration of Cloud and Edge Computing and Application
  • Sponsored and Organized by

    IEEE
    IEEE CS
    IEEE TCSC
    IEEE HI TC
    IEEE CPSS
    IETI
    Zhengzhou University
    Xidian University
    Hainan University